JPH0127577B2 - - Google Patents

Info

Publication number
JPH0127577B2
JPH0127577B2 JP55099943A JP9994380A JPH0127577B2 JP H0127577 B2 JPH0127577 B2 JP H0127577B2 JP 55099943 A JP55099943 A JP 55099943A JP 9994380 A JP9994380 A JP 9994380A JP H0127577 B2 JPH0127577 B2 JP H0127577B2
Authority
JP
Japan
Prior art keywords
pellet
recognition
bonding head
predetermined
head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55099943A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5726448A (en
Inventor
Tatsuo Sugimoto
Masakazu Ozawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP9994380A priority Critical patent/JPS5726448A/ja
Publication of JPS5726448A publication Critical patent/JPS5726448A/ja
Publication of JPH0127577B2 publication Critical patent/JPH0127577B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H01L2224/83805—Soldering or alloying involving forming a eutectic alloy at the bonding interface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Image Processing (AREA)
  • Die Bonding (AREA)
  • Image Analysis (AREA)
JP9994380A 1980-07-23 1980-07-23 Pellet attaching device with recognizing mechanism Granted JPS5726448A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9994380A JPS5726448A (en) 1980-07-23 1980-07-23 Pellet attaching device with recognizing mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9994380A JPS5726448A (en) 1980-07-23 1980-07-23 Pellet attaching device with recognizing mechanism

Publications (2)

Publication Number Publication Date
JPS5726448A JPS5726448A (en) 1982-02-12
JPH0127577B2 true JPH0127577B2 (en]) 1989-05-30

Family

ID=14260786

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9994380A Granted JPS5726448A (en) 1980-07-23 1980-07-23 Pellet attaching device with recognizing mechanism

Country Status (1)

Country Link
JP (1) JPS5726448A (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2270117A2 (en) 1998-12-28 2011-01-05 Idemitsu Kosan Co., Ltd. Organic electroluminescence device

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58216428A (ja) * 1982-06-11 1983-12-16 Toshiba Corp 半導体チツプ供給装置
JPH0642341Y2 (ja) * 1984-07-20 1994-11-02 日本電気株式会社 マウント装置
JPH0793328B2 (ja) * 1988-01-18 1995-10-09 株式会社新川 ダイボンデイング方法
JPH02146832U (en]) * 1990-05-10 1990-12-13

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5417627B2 (en]) * 1974-12-25 1979-07-02
JPS51149781A (en) * 1975-06-17 1976-12-22 Agency Of Ind Science & Technol Device for mounting semiconductor laserelement
JPS5744687Y2 (en]) * 1977-07-18 1982-10-02

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2270117A2 (en) 1998-12-28 2011-01-05 Idemitsu Kosan Co., Ltd. Organic electroluminescence device

Also Published As

Publication number Publication date
JPS5726448A (en) 1982-02-12

Similar Documents

Publication Publication Date Title
US3813022A (en) Wire bonder apparatus
KR940002761B1 (ko) 와이어 본딩 방법 및 장치
JPH0127577B2 (en])
JPH0367338B2 (en])
JP2581748B2 (ja) リードワイヤボンディング装置及び方法
US3855034A (en) Method and apparatus for bonding in miniaturized electrical circuits
KR100310282B1 (ko) 본딩 장치
JPH10598A (ja) 金型装置およびそれを用いた部品供給装置
KR0161436B1 (ko) 다이 본딩 장치
JP2578932B2 (ja) ダイボンディング装置
JPH04247631A (ja) ワイヤボンディング装置
JPS6116536A (ja) ペレツトボンデイング装置
JPH0416426Y2 (en])
JP2928590B2 (ja) ワイヤボンディング方法
JPH0237729A (ja) 半導体装置の製造方法
KR101932167B1 (ko) 다이 픽업장치
JPS5784143A (en) Controlling mechanism of bonder for z axial motion
JPH01194390A (ja) フラットパッケージｉｃ実装装置
JPH0220833Y2 (en])
JPH0223025B2 (en])
JPS5933975B2 (ja) 半導体搭載装置
JP3982915B2 (ja) ペレットボンディング装置
JPS6372132A (ja) 半導体ペレットの取り付け方法
JP3152147B2 (ja) ダイボンディング装置およびその機械調整方法
JPH04324942A (ja) ワイヤボンディング方法